Korean media — Samsung may use TSMC as well as its own foundry for HBM base dies
jukan05 relays Korean media that Samsung is collaborating not only with Samsung Foundry but also with TSMC on custom HBM base dies depending on customer requirements. Primary article not opened; root post truncated.
What happened
@jukan05 posted that, according to Korean media reports, Samsung is collaborating not only with Samsung Foundry but also with TSMC on custom HBM base dies, depending on customer requirements. The captured text continues that when TSMC manufactures the base die for Samsung Electronics' HBM, related chip design and optimization… — then truncates. The primary Korean article was not opened. Replies debate dual-sourcing and customer insistence; those are commentary, not the attributed report.
Why it matters
If accurate, custom base-die routing to TSMC ties HBM stack supply to scarce advanced-logic wafer capacity and customer-specific quals — a constraint channel for accelerator shipments beyond DRAM bit growth alone.
Positioning read
hbm-supply-binds — dual-sourcing base dies can ease a foundry bottleneck for Samsung Memory, but also puts HBM deeper into TSMC's contested wafer queue; either way the binding constraint stays in packaging/base-die/customer quals rather than commodity DRAM.
Connects to
2026-09-14-hbm-4hi-enough — same HBM supply debate; this item is about base-die foundry choice, not stack height.
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