Person
Jukan
8 documents in the archive.
Appearances newest first
jukan05: JPM HBM model now sees 16Hi adoption 2029 earliest. Replies split on earlier slip vs prolonged 8/12Hi scarcity; no JPM primary in-thread.
ZDNet Korea: D0a label shifts from VCT to W2W hybrid bonding (B1b); VCT becomes D0a-V; B1b under review for HBM5 (~2029).
jukan05 says the load-bearing angle is a possible Hynix–Intel JV with hyperscalers hungry for memory; replies stress prior denials, cycle cost, and that talks ≠ wafers this quarter.
jukan05 relays Korean media that Samsung is collaborating not only with Samsung Foundry but also with TSMC on custom HBM base dies depending on customer requirements. Primary article not opened; root post truncated.
jukan05 relays Korean media that Samsung Foundry's Texas Taylor fab started earlier than a planned November start, with utilization crossing ~20% last month and approaching ~30% this month. Primary outlet not opened this pass.
jukan05 relays Korean media that Taylor utilization hit ~30% (from ~20% last month), pulled forward vs a November plan on Tesla AI5 demand, with some expecting full utilization by year-end. Aju Press same week frames pilot lines and mass production early next year — a utilization-vs-pilot split.
jukan05 and ZDNet Korea report Samsung will use both Samsung Foundry and TSMC for custom HBM base dies by customer request, with Memory Division owning design when TSMC fabs the die. Replies frame it as avoiding turnkey isolation; wafer-capex allocation to TSMC remains the open bind.
jukan05 cites TrendForce that 4-Hi HBM is not enough and doubts suppliers would make it anyway; Jeff Pu concurs that datacenter de-spec to 4-Hi is unlikely. SemiAnalysis the same day argues 4-Hi maximizes tokens per HBM wafer for inference — a live supply-vs-architecture split.