Jukan 8 items
Discussion 2026-09-23 · 07:28 ET
Is 16Hi HBM really pushed to 2029 — and does that extend 12Hi tight?
jukan05: JPM HBM model now sees 16Hi adoption 2029 earliest. Replies split on earlier slip vs prolonged 8/12Hi scarcity; no JPM primary in-thread.
top-replies JPMorgan · SK Hynix · Samsung
News 2026-09-23 · 07:28 ET
Samsung renames D0a to hybrid bonding; eyes HBM5
ZDNet Korea: D0a label shifts from VCT to W2W hybrid bonding (B1b); VCT becomes D0a-V; B1b under review for HBM5 (~2029).
primary ZDNet Korea · Samsung · TechInsights
Discussion 2026-09-16 · 07:22 ET
Is the Hynix–Intel story really a hyperscaler memory JV — or just talks?
jukan05 says the load-bearing angle is a possible Hynix–Intel JV with hyperscalers hungry for memory; replies stress prior denials, cycle cost, and that talks ≠ wafers this quarter.
top-replies SK Hynix · Intel
News 2026-09-15 · 07:22 ET
Korean media — Samsung may use TSMC as well as its own foundry for HBM base dies
jukan05 relays Korean media that Samsung is collaborating not only with Samsung Foundry but also with TSMC on custom HBM base dies depending on customer requirements. Primary article not opened; root post truncated.
secondhand Korean media (via @jukan05) · Samsung · TSMC
News 2026-09-15 · 07:20 ET
Korean media — Samsung Taylor fab running early, utilization near 30%
jukan05 relays Korean media that Samsung Foundry's Texas Taylor fab started earlier than a planned November start, with utilization crossing ~20% last month and approaching ~30% this month. Primary outlet not opened this pass.
secondhand Korean media (via @jukan05) · Samsung
Discussion 2026-09-15 · 05:00 ET
Is Samsung Taylor's early ramp a real AI foundry recovery — or pilot optics?
jukan05 relays Korean media that Taylor utilization hit ~30% (from ~20% last month), pulled forward vs a November plan on Tesla AI5 demand, with some expecting full utilization by year-end. Aju Press same week frames pilot lines and mass production early next year — a utilization-vs-pilot split.
top-replies Samsung · Tesla · TSMC
Discussion 2026-09-15 · 04:02 ET
Does Samsung dual-sourcing HBM base dies with TSMC ease the HBM bind — or just meet customers?
jukan05 and ZDNet Korea report Samsung will use both Samsung Foundry and TSMC for custom HBM base dies by customer request, with Memory Division owning design when TSMC fabs the die. Replies frame it as avoiding turnkey isolation; wafer-capex allocation to TSMC remains the open bind.
top-replies Samsung · TSMC · NVIDIA
Discussion 2026-09-14 · 08:36 ET
Is datacenter HBM stuck above 4-Hi, or is shorter stack the inference optimum?
jukan05 cites TrendForce that 4-Hi HBM is not enough and doubts suppliers would make it anyway; Jeff Pu concurs that datacenter de-spec to 4-Hi is unlikely. SemiAnalysis the same day argues 4-Hi maximizes tokens per HBM wafer for inference — a live supply-vs-architecture split.
top-replies NVIDIA · TrendForce · SemiAnalysis
‹ All posts People /Jukan /Discussion ARCHIVE
Discussion · Wed, 16 Sept 2026 · 07:22 ET

Is the Hynix–Intel story really a hyperscaler memory JV — or just talks?

jukan05 says the load-bearing angle is a possible Hynix–Intel JV with hyperscalers hungry for memory; replies stress prior denials, cycle cost, and that talks ≠ wafers this quarter.

top-replies Jukan SK HynixIntel Source ↗
Review after: 2026-12-15

Opening

jukan's framing has the better question — who sits in a memory JV matters more than the Intel headline — but confirmation is thin. After amplifying a Reuters exclusive that SK Hynix is in talks with Intel on U.S. memory manufacturing, @jukan05 argues the overlooked piece is a possible JV with hyperscalers "hungry for memory supply." Visible replies emphasize prior rumor/denial cycles, that exploratory talks do not ship wafers this quarter, and cyclical cost risk of a U.S. memory site. Company: SK Hynix said no plans have been confirmed (relayed in the same window). Tail unread (top-replies).

Sides

FOR — structure with hyperscalers is the equity-relevant claim

  • @jukan05 [named] — Hynix–Intel could form a JV with hyperscalers; that matters more than the bilateral headline
  • @omijagun [anon] — onshoring + HBM bottleneck + Intel fabs framed as synergy (stance)

AGAINST / CAUTION — talks, denials, cycle, and timing

  • @Chaimeisenberg [named] — rumored weeks ago; SKH denied
  • @EvelynLinAlpha [pseudo] — talks ≠ U.S. fab; HBM path still process transfer, tools, yield; headline can reprice without wafers this quarter
  • @vsaietta [anon] — DRAM/NAND cyclical; U.S. site locks higher cost basis on a cycle bet
  • SK Hynix corporate relay [principal] — "NO PLANS HAVE BEEN CONFIRMED" on the reported talks (via quote in jukan window)

Room: supply-chain named voice plus wire; confirmation still secondhand sources-say.

Quotes

Not many people are paying attention, but what matters in the Hynix and Intel news is that Hynix and Intel could form a JV with hyperscalers hungry for memory supply. That's more important than the Hynix and Intel news itself. — Jukan (@jukan05)

SK HYNIX AND INTEL ARE IN TALKS TO MAKE MEMORY CHIPS IN THE US — Jukan (@jukan05)

Talks are not a US fab. If this is HBM-related, the slow parts are still process transfer, tool install, and yield. A headline can reprice INTC/SKHY today. It does not put wafers in Arizona this quarter. — Evelyn (@EvelynLinAlpha)

Wasn’t this rumored a few weeks ago and SKH denied? — Chaim Eisenberg (@Chaimeisenberg)

What would settle it

A signed lease, JV term sheet, or SEC/regulatory filing naming SK Hynix production at Intel Ohio (or another U.S. Intel site) and whether cloud firms are equity/offtake parties Knowable — company or regulator disclosure — through 2026-12-15 earliest checkpoint

SK Hynix or Intel confirmation (or hard denial) that distinguishes HBM vs commodity DRAM/NAND scope Knowable — next company statement — near-term

First disclosed U.S. HBM or advanced-memory wafer start under any Hynix–Intel structure Knowable — multi-year if the Ohio/Indiana paths are real — not this quarter

The Open/Close  ·  Research commentary, not investment advice. Positions may be held in securities mentioned.