Jukan 8 items
Discussion 2026-09-23 · 07:28 ET
Is 16Hi HBM really pushed to 2029 — and does that extend 12Hi tight?
jukan05: JPM HBM model now sees 16Hi adoption 2029 earliest. Replies split on earlier slip vs prolonged 8/12Hi scarcity; no JPM primary in-thread.
top-replies JPMorgan · SK Hynix · Samsung
News 2026-09-23 · 07:28 ET
Samsung renames D0a to hybrid bonding; eyes HBM5
ZDNet Korea: D0a label shifts from VCT to W2W hybrid bonding (B1b); VCT becomes D0a-V; B1b under review for HBM5 (~2029).
primary ZDNet Korea · Samsung · TechInsights
Discussion 2026-09-16 · 07:22 ET
Is the Hynix–Intel story really a hyperscaler memory JV — or just talks?
jukan05 says the load-bearing angle is a possible Hynix–Intel JV with hyperscalers hungry for memory; replies stress prior denials, cycle cost, and that talks ≠ wafers this quarter.
top-replies SK Hynix · Intel
News 2026-09-15 · 07:22 ET
Korean media — Samsung may use TSMC as well as its own foundry for HBM base dies
jukan05 relays Korean media that Samsung is collaborating not only with Samsung Foundry but also with TSMC on custom HBM base dies depending on customer requirements. Primary article not opened; root post truncated.
secondhand Korean media (via @jukan05) · Samsung · TSMC
News 2026-09-15 · 07:20 ET
Korean media — Samsung Taylor fab running early, utilization near 30%
jukan05 relays Korean media that Samsung Foundry's Texas Taylor fab started earlier than a planned November start, with utilization crossing ~20% last month and approaching ~30% this month. Primary outlet not opened this pass.
secondhand Korean media (via @jukan05) · Samsung
Discussion 2026-09-15 · 05:00 ET
Is Samsung Taylor's early ramp a real AI foundry recovery — or pilot optics?
jukan05 relays Korean media that Taylor utilization hit ~30% (from ~20% last month), pulled forward vs a November plan on Tesla AI5 demand, with some expecting full utilization by year-end. Aju Press same week frames pilot lines and mass production early next year — a utilization-vs-pilot split.
top-replies Samsung · Tesla · TSMC
Discussion 2026-09-15 · 04:02 ET
Does Samsung dual-sourcing HBM base dies with TSMC ease the HBM bind — or just meet customers?
jukan05 and ZDNet Korea report Samsung will use both Samsung Foundry and TSMC for custom HBM base dies by customer request, with Memory Division owning design when TSMC fabs the die. Replies frame it as avoiding turnkey isolation; wafer-capex allocation to TSMC remains the open bind.
top-replies Samsung · TSMC · NVIDIA
Discussion 2026-09-14 · 08:36 ET
Is datacenter HBM stuck above 4-Hi, or is shorter stack the inference optimum?
jukan05 cites TrendForce that 4-Hi HBM is not enough and doubts suppliers would make it anyway; Jeff Pu concurs that datacenter de-spec to 4-Hi is unlikely. SemiAnalysis the same day argues 4-Hi maximizes tokens per HBM wafer for inference — a live supply-vs-architecture split.
top-replies NVIDIA · TrendForce · SemiAnalysis
‹ All posts People /Jukan /Discussion ARCHIVE
Discussion · Wed, 23 Sept 2026 · 07:28 ET

Is 16Hi HBM really pushed to 2029 — and does that extend 12Hi tight?

jukan05: JPM HBM model now sees 16Hi adoption 2029 earliest. Replies split on earlier slip vs prolonged 8/12Hi scarcity; no JPM primary in-thread.

top-replies JukanJake Ayes JPMorganSK HynixSamsungMicron Source ↗
Review after: 2026-12-15

Opening

jukan05's JPM relay — 16Hi adoption 2029 at earliest — is the load-bearing print; the room mostly treats it as late vs prior mental models, not as disproved. @jukan05 (Tue ~7:38pm ET): "JPM has updated its HBM model and now expects 16Hi HBM adoption in 2029 at the earliest." Visible replies cluster on surprise at the calendar and on whether delay extends 8Hi/12Hi tightness; one voice says it will land earlier once DRAM supply loosens from 2028. No JPMorgan note text or table appears in-thread — claim is secondhand via a tier-2 supply-chain account. Deep tail unread (top-replies).

Sides

FOR — 16Hi is a 2029+ event; near-term stack stays 8/12Hi

  • @jukan05 [pseudo] — JPM model update: 16Hi adoption 2029 earliest
  • @aidriventrading [anon] — if 16Hi slips to 2029, near-term bottleneck stays 12Hi yield/stacking/capacity → packaging constraints extend
  • @DataInsightLab [anon] — asks whether JPM's 2029 assumes JEDEC height lift toward 900µm vs current 775µm limit (unanswered in sample)

AGAINST — calendar too late; 16Hi arrives sooner

  • @AnalysisOp [anon] — will be earlier; timed to more DRAM supply capacity from 2028 on

THIRD — wrong question / substitute

  • @jake_ayes [named] — with optical interconnect around then, do we even need 16Hi?
  • @shadowaguy [anon] — if HBM supply was the bind, this timeline implies a weirder bottleneck

Room: single named supply-chain relay of a bank model; replies mostly anon reaction. No OEM or memory-maker confirmation in the visible sample.

Quotes

JPM has updated its HBM model and now expects 16Hi HBM adoption in 2029 at the earliest.

Good morning. — Jukan (@jukan05)

Will be earlier. Just in time when there will be more DRAM Supply capacity out there (from 2028 on) — Alex A.C. (@AnalysisOp)

If 16Hi slips to 2029, the near term bottleneck stays with 12Hi yield, stacking and capacity. That could extend today’s packaging constraints. — David (@aidriventrading)

With optical interconnect around then do we even ever really need it? — Jake Ayes (@jake_ayes)

If JEDEC does lift the height cap toward 900um, does JPM's 2029 timing assume that change or the current 775um limit? — Data Insight Lab (@DataInsightLab)

What would settle it

A primary JPMorgan (or other bulge) HBM supply/demand note stating 16Hi volume timing with stack-height / JEDEC assumptions Knowable — sell-side note or client deck leak with dated model — through 2026-12-15

Memory-maker or GPU/ASIC OEM guidance that names 16Hi SKU qualification or volume start year Knowable — earnings / tech-day roadmap language — through 2027-06-30

JEDEC package-height spec change (e.g. toward ~900µm) that unlocks taller stacks on the critical path jukan's thread flags Knowable — JEDEC / industry standard publication — through 2027-03-31

Delta

Builds on the Sep 14 4-Hi vs taller-stack frame: new falsifiable calendar for 16Hi specifically, still without a primary bank PDF in-thread.

The Open/Close  ·  Research commentary, not investment advice. Positions may be held in securities mentioned.